14 stories tagged power-electronics on EV Digest.
ROHM Semiconductor has launched its fourth-generation 650V insulated-gate bipolar transistors (IGBTs), designed to boost the performance and efficiency of key components in electric vehicles. These automotive-grade power switching devices are specifically tailored for EV electric compressors and high-voltage heaters, addressing critical thermal management and climate control needs.
A new webinar from Parker Lord will delve into the critical aspects of thermal management for power electronics. The session aims to highlight the design considerations that influence cost and manufacturing complexity, drawing key comparisons between systems used in electric vehicles and stationary battery energy storage.
Power Integrations has introduced its PowiGaN gallium nitride (GaN) technology, now rated for an industry-leading 2,200 volts. This advancement allows for more efficient power conversion in demanding applications like ultra-fast EV charging infrastructure, pushing the boundaries of what's possible in high-voltage systems.
Pickering Interfaces has unveiled its new 60-191 LXI family, featuring their highest-current switching products to date. These devices can handle signals up to 80 amps and 300 volts, designed for automated test environments that manage multiple high-current power supplies, crucial for developing and validating EV components.
The electrification of heavy-duty, off-highway vehicles presents unique engineering challenges, particularly concerning thermal management for critical components like battery systems and power electronics. Ensuring operator comfort through efficient climate control also becomes a significant design consideration, requiring a fresh approach compared to traditional ICE machinery.
Danisense has introduced a new current transducer designed for isolated DC and AC current measurements in PCB-mounted power electronics. This technology can enhance precision and efficiency in electric vehicle applications, ensuring optimal performance and safety within their complex power systems. The DP12IP model measures currents up to 18 A with high linearity, leveraging closed-loop compensated fluxgate technology.
Magnachip Semiconductor is expanding into the high-voltage silicon carbide (SiC) market by licensing Navitas Semiconductor's GeneSiC technology. This partnership enables Magnachip to develop and produce SiC products for power conversion applications in electric vehicles, among other sectors. The licensed Gen 4 and Gen 5 GeneSiC Trench-Assisted Planar (TAP) technologies target voltage requirements from 1200 V and above, crucial for efficient EV power systems.
General Motors is looking to hire an Advanced Electric Drive and Power Electronics Engineer at its Warren, Michigan facility. This role will be crucial in developing next-generation EV propulsion systems and power electronics, underscoring GM's ongoing investment in talent to drive its electrification strategy forward.
Researchers at Oak Ridge National Laboratory have developed a novel motor drive design capable of canceling common-mode voltage and neutral-point current. This innovation, still in the simulation phase, could significantly enhance the longevity and efficiency of multi-phase electric motors, particularly in demanding heavy-duty transportation sectors.
Bosch has commenced sample production of silicon carbide (SiC) power semiconductors at its new chip fabrication facility in Roseville, California. This marks Bosch's first semiconductor manufacturing presence in the U.S. and will bolster the supply of critical components for electric vehicle powertrains. The facility, which received support from federal CHIPS funding, represents a significant investment by the company in domestic automotive technology.
Soitec and China's ZenSemi are collaborating to bring high-volume production of 300 mm BCD-on-SOI power integrated circuits to market. These advanced semiconductors are critical for power electronics, enabling greater efficiency and performance in EV charging, motor control, and other applications.
IBM has announced a new chip manufacturing technique that could lead to significantly smaller and more efficient semiconductor components. This innovation has strong implications for electric vehicles, as it could enable more compact and powerful inverters and other crucial power electronics.
Semiconductor manufacturer ROHM has introduced an innovative surface-mount package for silicon carbide (SiC) MOSFETs, offering thermal performance on par with larger through-hole components. This advancement allows for more efficient power conversion in electric vehicles, supporting higher currents and enabling faster charging. The new design also streamlines manufacturing processes by being compatible with automated assembly lines.
Vishay Intertechnology has expanded its Gen 7 family of 1200 V FRED Pt Hyperfast rectifiers, introducing six new diodes designed for electric vehicle applications. These components are engineered to reduce switching losses in high-voltage power converters, thereby improving efficiency in onboard chargers and other EV systems. The new rectifiers boast a low reverse recovery charge and a low forward voltage drop, catering to the demanding requirements of modern EV powertrains.
